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Hesse & knipps bondjet 715M bonder BJ715M flip chip


HESSE & KNIPPS BONDJET 715M BJ715M BONDER
Here's some information we found about this machine on the internet. Please do your own research as this is just information and we do not guarantee this information.
HESSE & KNIPPS Bondjet BJ715M Rotary bond head wedge-wedge bonder, Automatic Thin Wire Bonder, Working Area: 255mm x 180mm (10” x 7”), Piezo-bondhead 89 incl. 98kHz transducer, TFT color monitor, 17”, Heating table 8” x 10”, Height adjustable, Bonding Velocity: < 200 ms (1 wire , 45°, 2 mm length), Fine Pitch: Better than 45 µm (depending on wire diameter), Wire Diameters: 17,5 µm - 85,0 µm ( 0.7 mil - 3.4 mil ), Wires: Aluminum, Gold, Copper, Ribbon



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